adhesive bonding
and curing Processes
EWI offers comprehensive support for all adhesive bonding and curing processes. Our scientists and engineers conduct electronics adhesives-oriented activities and are fluent in broad-based adhesive technologies such as thermosetting, elastomeric, thermoplastic, natural and synthetic adhesives, structural, and non-structural applications.
Laboratories at EWI contain equipment for applying materials by cartridge, syringe, spray, and hotmelt methods. We also have the capabilities to conduct heat, UV, microwave, and induction curing processes since most polymer systems require some type of curing process to speed production rates.
Members benefit from EWI’s impartial judgment on materials and processes, plant audits, process evaluations and advice on materials consolidation. We also offer Members complete adhesive bonding protocols, ready to implement. And we maintain a database of more than 150 suppliers of adhesives, coatings, sealants, polymers, and processing and packaging equipment so that we can respond quickly to their needs.
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Joining Processes
