EWI SonicSolder

EWI SonicSolder is an EWI patented binary lead-free solder alloy that melts at 231°C. In conjunction with ultrasonic soldering, it can be used to join difficult-to-wet materials like aluminum, titanium, glass, and ceramics.  In various metal-metal (copper, aluminum, titanium) combinations, shear strength of about 5 ksi have been obtained.

EWI SonicSolder is of interest in the medical industry due to its bio-compatibility. The lack of silver in its composition also makes it highly attractive for lead-free soldering in electronics applications. Using conventional melting practices, it can be easily produced into simple shapes such as wires.

Download our Sonic Solder brief or read more about Ultrasonic Soldering and Sonic Solder in a recently published Insights article.

Licensing contact: Kirk Cooper
Phone: 614.688.5069; E-mail: kcooper@ewi.org

Technical contact: Shankar Srinivasan, PhD
Phone: 614.688.5059; E-mail: ssrinivasan@ewi.org